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Manufacture of electronic circuit device and its application technology
  • Measuring position determining device
    The present disclosure relates to a measurement position determination device. Conventionally, a component mounting machine that measures the height of a substrate when mounting a component on a substrate is known. For example, the component mounting machine described in Patent Document 1 measures the heights of the measurement points of nine points set in a grid pattern on the substrate, and derives a correction value for the height of the operating point on the substrate based on the measurement values. Prior Art Literature Patent Literature Patent Literature 1: Japan Re-Table 2014/033856 ...
  • Measuring position determining device
    The present disclosure relates to a measurement position determination device. Conventionally, a component mounting machine that measures the height of a substrate when mounting a component on a substrate is known. For example, the component mounting machine described in Patent Document 1 measures the heights of the measurement points of nine points set in a grid pattern on the substrate, and derives a correction value for the height of the operating point on the substrate based on the measurement values. Prior Art Literature Patent Literature Patent Literature 1: Japan Re-Table 2014/033856 ...
  • Water pump for electronic component water-cooled cooler
    The present invention relates to a water pump, and more particularly, to a water pump for a water-cooled cooler of electronic components for cooling electronic components. The water pump of the existing electronic component water-cooled cooler adopts a method of setting an impeller between the chamber and the water module (or heat transfer base) to push the working fluid. However, the working fluid passes through the water module and then through the chamber. In order to perform heat exchange, it is necessary to re-pass along the pipeline through a radiator and a fan ...
  • Water pump for electronic component water-cooled cooler
    The present invention relates to a water pump, and more particularly, to a water pump for a water-cooled cooler of electronic components for cooling electronic components. The water pump of the existing electronic component water-cooled cooler adopts a method of setting an impeller between the chamber and the water module (or heat transfer base) to push the working fluid. However, the working fluid passes through the water module and then through the chamber. In order to perform heat exchange, it is necessary to re-pass along the pipeline through a radiator and a fan ...
  • Flexible circuit board for all-in-one chip on film, chip package including the same, and electronic device including the same
    The embodiment relates to a flexible circuit board for an all-in-one chipon film, a chip package including the same, and an electronic device including the same. Specifically, a flexible circuit board for an all-in-one chip on a film, a chip package thereof, and an electronic device including the same. The flexible circuit board for an all-in-one chip on a film may be capable of mounting different types of chips on one substrate. Flexible circuit board. recently,...
  • Flexible circuit board for all-in-one chip on film, chip package including the same, and electronic device including the same
    The embodiment relates to a flexible circuit board for an all-in-one chipon film, a chip package including the same, and an electronic device including the same. Specifically, a flexible circuit board for an all-in-one chip on a film, a chip package thereof, and an electronic device including the same. The flexible circuit board for an all-in-one chip on a film may be capable of mounting different types of chips on one substrate. Flexible circuit board. recently,...
  • Manufacturing method and process of organic electronic device
    The invention relates to a method for manufacturing an organic electronic device. An organic electronic device includes a device substrate in which a first electrode, a device functional portion (including an organic layer), and a second electrode are sequentially provided on a substrate, and a sealing member that seals the device functional portion. As a sealing member, the sealing member which laminated | stacked the adhesive layer (resin composition layer) on the sealing base material (support body) like the patent document 1, for example is known. This sealing member is bonded ...
  • Manufacturing method and process of organic electronic device
    The invention relates to a method for manufacturing an organic electronic device. An organic electronic device includes a device substrate in which a first electrode, a device functional portion (including an organic layer), and a second electrode are sequentially provided on a substrate, and a sealing member that seals the device functional portion. As a sealing member, the sealing member which laminated | stacked the adhesive layer (resin composition layer) on the sealing base material (support body) like the patent document 1, for example is known. This sealing member is bonded ...
  • Manufacturing method of organic electroluminescent laminated body
    The present invention relates to an organic electroluminescent laminate. An organic el device (oeld device) using an organic el (electroluminescence) material is used for a display, a lighting device, or the like. The organic el material used for the organic el device is very water-resistant. Therefore, in the organic el device, by adopting a structure in which both sides are sealed with a glass plate or the like, the organic el material caused by moisture is prevented ...
  • Manufacturing method of organic electroluminescent laminated body
    The present invention relates to an organic electroluminescent laminate. An organic el device (oeld device) using an organic el (electroluminescence) material is used for a display, a lighting device, or the like. The organic el material used for the organic el device is very water-resistant. Therefore, in the organic el device, by adopting a structure in which both sides are sealed with a glass plate or the like, the organic el material caused by moisture is prevented ...
  • Method and process for printing structured silver coating with improved current carrying capacity
    The invention relates to a method for producing a silver coating on a glass disc by screen printing, and a glass disc produced according to the method, which glass disc is preferably a heatable vehicle glass. In order to produce heatable vehicle glass, the glass discs are provided with bus bars and heating conductors. The busbars have brazed contact surfaces for the busbars. When required, soldering for connecting antennas or alarm circuits can be performed ...
  • Method and process for printing structured silver coating with improved current carrying capacity
    The invention relates to a method for producing a silver coating on a glass disc by screen printing, and a glass disc produced according to the method, which glass disc is preferably a heatable vehicle glass. In order to produce heatable vehicle glass, the glass discs are provided with bus bars and heating conductors. The busbars have brazed contact surfaces for the busbars. When required, soldering for connecting antennas or alarm circuits can be performed ...
  • Method, device and process for perforating polar code
    The present disclosure relates generally to wireless communications, and more particularly to methods and systems for punctured-based rate matching for polar codes. As e.arikan in "channelpolarization: amethodforconstructingcapacity-achievingcodesforsymmetricbinary-inputmem ...
  • Method, device and process for perforating polar code
    The present disclosure relates generally to wireless communications, and more particularly to methods and systems for punctured-based rate matching for polar codes. As e.arikan in "channelpolarization: amethodforconstructingcapacity-achievingcodesforsymmetricbinary-inputmem ...
  • Manufacturing method of capacitive proximity switch device
    The invention relates to a capacitive proximity switch device. It also relates to an internal and / or external component for a motor vehicle having at least one capacitive proximity switch device. It is known in the prior art to manufacture vehicle components from a fiber composite material, which can have, for example, carbon fibers, which are embedded in a plastic matrix. The carbon fiber functions as a reinforcing fiber of the member and can be designed to be reinforced along the force flow line. by...
  • Manufacturing method of capacitive proximity switch device
    The invention relates to a capacitive proximity switch device. It also relates to an internal and / or external component for a motor vehicle having at least one capacitive proximity switch device. It is known in the prior art to manufacture vehicle components from a fiber composite material, which can have, for example, carbon fibers, which are embedded in a plastic matrix. The carbon fiber functions as a reinforcing fiber of the member and can be designed to be reinforced along the force flow line. by...
  • Comparison circuit, semiconductor device, electronic component, and electronic device
    An embodiment of the present invention disclosed in the specification, drawings, and claims of the present application (hereinafter referred to as the present specification and the like) relates to a semiconductor device, a method of operating the same, a method of using the same, a method of manufacturing the same, and the like. Note that one embodiment of the present invention is not limited to the above. Semiconductor devices using a negative voltage are known. For example, in order to reduce the threshold leakage current, the substrate bias voltage of an n-channel mos transistor is a negative voltage, ...
  • Comparison circuit, semiconductor device, electronic component, and electronic device
    An embodiment of the present invention disclosed in the specification, drawings, and claims of the present application (hereinafter referred to as the present specification and the like) relates to a semiconductor device, a method of operating the same, a method of using the same, a method of manufacturing the same, and the like. Note that one embodiment of the present invention is not limited to the above. Semiconductor devices using a negative voltage are known. For example, in order to reduce the threshold leakage current, the substrate bias voltage of an n-channel mos transistor is a negative voltage, ...
  • Method, equipment and process for reducing influence of random mismatch of transistors in circuit
    Priority Application This application claims priority rights to U.S. Application No. 15 / 482,020, filed on April 7, 2017, which is incorporated herein by reference in its entirety. Random offsets caused by random mismatch of transistors can exist in analog circuits (such as operational amplifiers, comparators, current mirrors, analog-to-digital converters, and digital-to-analog converters). Such offsets can affect circuit performance to unreachable ...
  • Method, equipment and process for reducing influence of random mismatch of transistors in circuit
    Priority Application This application claims priority rights to U.S. Application No. 15 / 482,020, filed on April 7, 2017, which is incorporated herein by reference in its entirety. Random offsets caused by random mismatch of transistors can exist in analog circuits (such as operational amplifiers, comparators, current mirrors, analog-to-digital converters, and digital-to-analog converters). Such offsets can affect circuit performance to unreachable ...
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Technical classification